Welcome to the community page of 3D-ICs
The industry is actively exploring 3D semiconductor technology for the next generation of logic and memory chips. This website is dedicated to keeping you informed about this exciting field. Our programs automatically mine the internet and provide you the latest news and literature.
3D Packaging and TSV News
3D Packaging and TSV Blogs
3D NAND Market Heats Up | Semiconductor Manufacturing
Panel: 3D-IC Design Experts Tackle “Practical Issues” in 2.5D and
Waiting For 3D Metrology | Semiconductor Manufacturing & Design
GlobalFoundries Demonstrates 3D TSV Capabilities on 20nm
Could 3d chip technology extend Moore's law to 2030?
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3D Packaging and TSV Papers
Guest Editorial: Special Issue on Testing of 3D Stacked Integrated Circuits
3D Architecture Implementation: A Survey
Lithography challenges for leading edge 3D packaging applications
Modeling and Experimentation: Characterization of Hot Spot Dissipation in 3D Stacks
Achieving fast and accurate extraction of 3D-IC layout structures
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