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EV Group Clears Key Barriers to 3D-IC/TSV Manufacturing - PCBDesign007
EV accelerates TSV production - ElectronicsWeekly.com
SEMICON West Features Emerging, Adjacent Tech Sessions - PCBDesign007
Part of the - Chip Design Magazine (blog)
EV Group Clears Key Barriers To 3D-IC/TSV High-Volume ...
Qualcomm: Scaling down is not cost-economic anymore - so we are ...
Qualcomm Calls for Monolithic 3D IC | EE Times
Qualcomm: Scaling down is not cost-economic anymore - so we are ...> View all articles
Transparent, Flexible 3D Memory Chips Could Replace Flash
First rumors about the demise of flash surfaces as early as 2004 when there was speculation that MRAM, OUM, PRAM or nanocrystal-supported flash would replace flash memory chips beyond the 32 nm scale by 2009. Despite the fact that flash is still going strong even in 2012, researchers believe they have identified a new technology that will replace flash someday: Transparent, flexible 3D memory chips. Read entire article